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Journal of Vibration Testing and System Dynamics

C. Steve Suh (editor), Stefano Lenci (editor),

Jiazhong Zhang (editor), Xianguo Tuo (editor)

Stefano Lenci (editor)

Polytechnic University of Marche, Italy

Email: lenci@univpm.it

C. Steve Suh (editor)

Texas A&M University, USA

Email: ssuh@tamu.edu

Jiazhong Zhang (editor)

Xi'an Jiaotong University, China

Email: jzzhang@mail.xjtu.edu.cn

Xiangguo Tuo (editor)

Sichuan University of Science and Engineering, China

Email: tuoxianguo@suse.edu.cn


Editors

Stefano Lenci C. Steve Suh
Xianguo Tuo Jiazhong Zhang

Associate Editors

Yoshihiro Deguchi Yu Guo Hamid R. Hamidzadeh
Jianzhe Huang Meng-Kun (Jason) Liu Kalyana Babu Nakshatrala
Kurt Vandervort Dimitry Volchenkov Baozhong Yang
Michael A. Zaks

Editorial Board

Farbod Alijani Junqiang Bai Mohamed Belhaq
Zhaobo Chen Francesco Clementi Frank Z Feng
Fotios Georgiadis Lei Guo Xin Hu
Krzysztof Kecik Ryoichi Kurose Liansheng Li
Ke Li Xiaofeng Liao Yan Liu
Yoonchan Oh Diego Orlando Laura Ruzziconi
Jihong Wen Lianhua Wang Hiroaki Watanabe
Xingzhong Xiong Guozhi Yao Weinian Zhang

Yoshihiro Deguchi

University of Tokushima, Japan

Email: ydeguchi@me.tokushima-u.ac.jp

Michael A. Zaks

Humboldt University of Berlin, Germany

Email: zaks@physik.hu-berlin.de

Yu Guo

Midwestern State University, USA

Email: yu.guo@mwsu.edu

Hamid R. Hamidzadeh

Tennessee State University, USA

Email: HHAMIDZADEH@tnstate.edu

Jianzhe Huang

Harbin Engineering University, China

Email: jianzhe@hrbeu.edu.cn

Meng-Kun (Jason) Liu

National Taiwan University of Science and Technology, Taiwan

Email: mkliu@mail.ntust.edu.tw

Kalyana Babu Nakshatrala

University of Houston, USA

Email: knakshat@central.uh.edu

Kurt Vandervort

Stress Engineering, USA

Email: kurt.vandervort@stress.com

Dimitry Volchenkov

Universität Bielefeld, Germany

Email: volchenk@physik.uni-bielefeld.de

Baozhong Yang

Schlumberger Inc., USA

Email: bzyang@gmail.com

Farbod Alijani

Delft University of Technology, The Netherlands

Fax: 773-442-5770 Email: F.Alijani@tudelft.nl

Junqiang Bai

Northwestern Polytechnical University, China

Email: junqiang@nwpu.edu.cn

Mohamed Belhaq

University of Casablanca, France

Email: mbelhaq@yahoo.fr

Zhaobo Chen

Harbin Institute of Technology, China

Email: chenzb@hit.edu.cn

Francesco Clementi

Polytechnic University of Marche, Italy

Email: francesco.clementi@univpm.it

Frank Z Feng

University of Missouri, USA

Email: FengF@missouri.edu

Fotios Georgiadis

Lincoln University, UK

Email: fgeorgiadis@lincoln.ac.uk

Lei Guo

Beihang University, China

Email: lguo@buaa.edu.cn

Xin Hu

Schlumberger Inc., USA

Email: trible200@gmail.com

Krzysztof Kecik

Technical University of Lublin, Poland

Email: k.kecik@pollub.pl

Ryoichi Kurose

Kyoto University, Japan

Email: kurose@mech.kyoto-u.ac.jp

Liansheng Li

Hefei General Machinery Research Institute, China

Email: lianshengli@126.com

Ke Li

Schlumberger Inc., USA

Email: KLi2@slb.com

Xiaofeng Liao

Southwest University, China

Email: xfliao@cqu.edu.cn

Yan Liu

Northwestern Polytechnical University, China

Email: liuyan@nwpu.edu.cn

Yoonchan Oh

Apple Inc., USA

Email: peace07w@gmail.com

Diego Orlando

PUC Rio de Janeiro, Brazil

Email: dgorlando@gmail.com

Laura Ruzziconi

Università Politecnica delle Marche, Italy

Email: laura.ruzziconi@uniecampus.it

Jihong Wen

National University of Defense Technology, China

Email: wenjihong@nudt.edu.cn

Lianhua Wang

Hunan University, China

Email: Lhwang@hnu.edu.cn

Hiroaki Watanabe

Kyushu University

Email: whiroaki@mech.kyushu-u.ac.jp

Xingzhong Xiong

Sichuan University of Science and Engineering, China

Email: xzxiong@suse.edu.cn

Guozhi Yao

Modine Manufacturing Company, USA

Email: G.Yao@na.modine.com

Weinian Zhang

Sichuan University, China

Email: wnzhang@scu.edu.cn